Welcome to ICAVE2018

2018 2nd International Conference on Automotive and Vehicle Engineering

Automobile engineering, is a branch of vehicle engineering, incorporating elements of mechanical, electrical, electronic, software and safety engineering as applied to the design, manufacture and operation of motorcycles, automobiles and trucks and their respective engineering subsystems.

Welcome to the official website of the 2018 2nd International Conference on Automotive and Vehicle Engineering (ICAVE2018). The conference will be held in Singapore during September 3-5, 2018. ICAVE2018 is a workshop of ICITE2018. The aim of ICAVE 2018 is to present the latest research and results of scientists related to Automotive and Vehicle Engineering topics. This conference provides opportunities for the different areas delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration.

Submission Info. | 投稿

Authors are invited to submit papers through the Electronic Submission System before July 01, 2018.

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Proceedings | 论文集

The accepted papers of ICAVE will be published in the ICITE Conference Proceedings as a special chapter, which will be reviewed by IEEE publication program and be submitted for inclusion into IEEE Xplore, Ei Compendex and Scopus.

Important Dates | 重要日期

Submission Deadline:  July 01st, 2018

Acceptance Notice:  July 20th, 2018

Registration Due:  August 01st, 2018

Singapore | 新加坡

Singapore is much more than the sum of its numerous attractions. It’s constantly evolving, reinventing, and reimagining itself, with people who are passionate about creating new possibilities.

ICAVE2018 Keynote & Plenary Speakers

Prof. Lee Der Horng

National University of Singapore, Singapore

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Prof. Denis GILLET

École Polytechnique Fédérale de Lausanne (EPFL), Switzerland

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Prof. Monteiro Figueira

University Lusofona, Portugal

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Prof. Alan Nicholson

University of Canterbury, New Zealand

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Dr. Huaqun Guo

Institute for Infocomm Research, Singapore

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